board (Total 247187 Patents Found)

A work management system has input means having a function of inputting coordinate information from the surface of a panel, output means having a function of projecting electronic information onto the panel, and data processing means for executing a predetermined processing, e.g., preparation and input processing of a ...
A game includes a stimulus board having a number of emotionally significant words arranged thereon. Lettered playing pieces are employed to permit players to complete words on the board and thus receive an intermediate reward. The word completed is used as a jumping off point for storytelling, answering questions about...
A printed circuit board for minimizing thermally-induced mechanical damage of solder joints electrically connecting electronic components to the printed circuit board. The printed circuit board includes a first substrate, solder pads, and an expansion layer. The first substrate has two substantially parallel major surf...
A decorative coating layer, unified with the succulent and fragile surface of a concrete board, is formed by a method comprising laminating an inorganic and hydraulic coating material on the surface of an unhardened concrete board placed in a mold, and immediately thereafter heat-curing the thus coated concrete board. ...
Wide word memory parts (608) are tested in a design for test "DFT" mode at elevated temperatures. The parts are mounted on test boards (600) and only the set of data I/O leads 0-3 active in the "DFT" mode, which is less than the total number of data I/O leads 0-15, connect to substrate terminals (604) t...
A printed circuit board (23) having a plurality of solder coated contact pads (24, 26) for the surface mounting of electrical components (10 1 ) thereon. Each pad (24, 26) has a rectangular portion and a triangular portion extending in the direction of the component's body (18) so as to reduce the amount of solder ...
In order to provide an electronic device that has high package density and can facilitate electrical connection between a plurality of circuit boards therein, the electronic device comprises a frame having two mutually opposed openings through major planes, a plurality of circuit boards disposed in the frame parallel t...
A method of manufacturing a printed circuit board is disclosed, in which a cavity is formed for embedding a component, which includes: providing a core board, in which an inner circuit is buried; forming a first via in the core board for interlayer conduction; selectively forming a first photoresist in a position on th...
An IC chip, a board, information processing equipment, and a storage medium are provided that can prevent, even when information is transferred between a plurality of programs, leaking of a right protection algorithm of information in connection with the transfer, by generating an encryption key using a separately prov...
A method for fabricating the high-density IC substrate by selectively electroplating without the electrically conductive route is provided. In this method, the specific resin layer with thickness of 1-5 μm is coated on the matte side of the copper clad, and then the compound layer of the copper clad and the resin is a...
A projection exposure apparatus and a method for producing a printed circuit board wherein, the whole pattern including pieces 10 and coupons 12 to be exposed on a print circuit board 2 is depicted on a photo mask 1 divided in six areas by divide line 19 , the exposure will be made with respect to the each div...
A blade ( 10 ) for use in the slitting of a paper or board web has a hub part ( 11 ) and a blade part ( 15 ). The blade part ( 15 ) is releasably secured by means of securing members ( 12, 13 ) to the hub part ( 12 ). The securing members ( 12, 13 ) are formed so as to distribute and/or maintain the axial load enabling...
Modification of the connections between a die package and a system board is described. In one example a pattern redistribution module is used in a socket. The module has a first array of contacts on one side of the module. The contacts have a first configuration to connect to the socket. A second array of contacts is o...
This invention provides a multilayer printed wiring board which achieves fine pitches. A heat resistant substrate is incorporated in a multilayer printed wiring board and interlayer resin insulation layer and conductive layer are placed alternately on the heat resistant substrate. A built-up wiring board in which respe...
Disclosed is a method for manufacturing a circuit board, comprising step for preparing an insulating member and an electronic component having position-setting means on the lower surface thereof (S 110 ), step for forming mounting holes in the insulating member (S 120 ), step for mounting the electronic component on th...
A process for producing a perforated board comprising a cementitious layer and first and second facers is provided, the process comprising: (a) providing a substrate comprising a first facer; (b) applying a slurry comprising a cementitious material on the substrate; (c) providing a second facer above the slurry; and (d...
An on-board re-inflatable containment boom for a waterborne vessel that lies substantially flat and capable of being spooled when deflated and floats in the proper orientation when inflated, that has re-inflatable float sections which are sequentially inflated during deployment and sequentially deflated during recovery...
An access control reader device integrates a touch pad in proximity to a radio frequency identification (RFID) antenna. A touch pad circuit board includes the RF antenna having a physical aperture and the capacitive touch pad positioned at least partially within the physical aperture of the RF antenna. This configurati...